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TuF3 - Interconnect Subsystems Session Presider: Chongjin Xie
1:30-2:30 Salon VIII
TuF3.1 -
High-speed VCSELs for OOK and Multilevel PAM Modulation Invited
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America/Denver High-speed VCSELs for OOK and Multilevel PAM Modulation VCSELs designed for high-speed modulation and a proper balance between optical power and modulation amplitude, intensity noise, and damping of the modulation response have enabled data-rates exceeding 70 Gbit/s under OOK-NRZ modulation and data-rates approaching 100 Gbit/s under PAM-4 modulation. Hilton Santa Fe Historic Plaza Salon VIII

    A. Larsson , Chalmers Univ. of Technology, Gothenburg, Sweden, J. Gustavsson , Chalmers Univ. of Technology, Gothenburg, Sweden E. Haglund , Chalmers Univ. of Technology, Gothenburg, Sweden E. Haglund , Chalmers Univ. of Technology, Gothenburg, Sweden T. Lengyel , Chalmers Univ. of Technology, Gothenburg, Sweden E. Simpanen , Chalmers Univ. of Technology, Gothenburg, Sweden

    VCSELs designed for high-speed modulation and a proper balance between optical power and modulation amplitude, intensity noise, and damping of the modulation response have enabled data-rates exceeding 70 Gbit/s under OOK-NRZ modulation and data-rates approaching 100 Gbit/s under PAM-4 modulation.
TuF3.2 -
25-Gb/s Transmission Over 2.5-km SSMF by Silicon MRR Enhanced 1.55-μm III-V/SOI DML
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America/Denver 25-Gb/s Transmission Over 2.5-km SSMF by Silicon MRR Enhanced 1.55-μm III-V/SOI DML The use of a micro-ring resonator (MRR) to enhance the modulation extinction ratio and dispersion tolerance of a directly modulated laser (DML) is experimentally investigated with a bit rate of 25 Gb/s as proposed for the next generation data center communications. Hilton Santa Fe Historic Plaza Salon VIII

    V. Cristofori , Technical Unversity of Denmark, Kgs. Lyngby, Denmark, F. Da Ros , Technical Unversity of Denmark, Kgs. Lyngby, Denmark O. Ozolins , NETLAB, Acreo Swedish ICT, Kista, Sweden M. Chaibi , FOTON Laboratory, ENSSAT, University of Rennes 1, Lannion, France L. Bramerie , FOTON Laboratory, ENSSAT, University of Rennes 1, Lannion, France Y. Ding , Technical Unversity of Denmark, Kgs. Lyngby, Denmark X. Pang , NETLAB, Acreo Swedish ICT, Kista, Sweden A. Shen , III-V Lab, Palaiseau, France A. Gallet , III-V Lab, Palaiseau, France G. Duan , III-V Lab, Palaiseau, France K. Hassan , CEA-Leti, Grenoble, France S. Olivier , CEA-Leti, Grenoble, Denmark S. Popov , School of ICT, KTH Royal Institute of Technology, Kista, Sweden G. Jacobsen , NETLAB, Acreo Swedish ICT, Kista, Sweden L. Oxenløwe , Technical Unversity of Denmark, Kgs. Lyngby, Denmark C. Peucheret , FOTON Laboratory, ENSSAT, University of Rennes 1, Lannion, France

    The use of a micro-ring resonator (MRR) to enhance the modulation extinction ratio and dispersion tolerance of a directly modulated laser (DML) is experimentally investigated with a bit rate of 25 Gb/s as proposed for the next generation data center communications.
TuF3.3 -
Low-loss and Broadband Polarization Splitter and Rotator and its Application in DWDM Receiver
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America/Denver Low-loss and Broadband Polarization Splitter and Rotator and its Application in DWDM Receiver A broadband silicon PSR is presented with an insertion loss lower than ~0.7dB/0.3dB and crosstalk lower than 12.1dB/14.7dB for TE and TM mode respectively. By combining the PSR with AWG and Germanium PDs, an integrated polarization insensitive DWDM receiver is further demonstrated. Hilton Santa Fe Historic Plaza Salon VIII

    Y. Zhao , SIMIT, Shanghai, China

    A broadband silicon PSR is presented with an insertion loss lower than ~0.7dB/0.3dB and crosstalk lower than 12.1dB/14.7dB for TE and TM mode respectively. By combining the PSR with AWG and Germanium PDs, an integrated polarization insensitive DWDM receiver is further demonstrated.
TuF3.4 -
Some Advances on Optical Interconnects Invited
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America/Denver Some Advances on Optical Interconnects We discuss the advances of several optical interconnect options, including the VCSEL based, the Si-photonics based, and the monolithically integrated approaches. In addition, we discuss the possibility of using optical method to power and connect smartdust type of devices. Hilton Santa Fe Historic Plaza Salon VIII

    N. Li , IBM, Yorktown Heights, NY, United States, T. Barwicz , IBM, Yorktown Heights, NY, United States W. Green , IBM, Yorktown Heights, NY, United States D. Sadana , IBM, Yorktown Heights, NY, United States

    We discuss the advances of several optical interconnect options, including the VCSEL based, the Si-photonics based, and the monolithically integrated approaches. In addition, we discuss the possibility of using optical method to power and connect smartdust type of devices.